Chandrasekhar argues for more chip design and advanced packaging

Business Today reports former IT minister Rajeev Chandrasekhar’s argument that India should capture more semiconductor value through design, intellectual property, advanced packaging and research. He contrasts those areas with conventional assembly and packaging as AI changes chip architectures. This is his strategic recommendation, not a newly enacted government programme.

DTT summary based on Business Today's report. The full article is on the publisher's site.