IIT Guwahati and Tata Electronics plan semiconductor packaging centre and courses

IIT Guwahati has signed a memorandum of understanding with Tata Electronics to set up a Centre of Excellence for semiconductor Assembly, Testing, Marking and Packaging (ATMP). The planned collaboration covers education, practical training and research in the steps that turn fabricated chips into tested, packaged components ready for use. IIT Guwahati will lead diploma-level training and BTech-level programmes, with course content and specialised modules developed jointly with Tata Electronics. Students are expected to receive hands-on training at the company and take part in packaging, assembly and testing research. The partnership also aims to involve engineering colleges, polytechnics and other institutions across Assam and the Northeast, including training faculty. This is an agreement for a planned centre and programmes, not an announcement that the centre is already operating or that a new chip technology has been demonstrated.

DTT summary based on The Indian Express's report. The full article is on the publisher's site.